SINAX VS40

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Introducing our cutting-edge Wafer Measuring System, designed specifically for the semiconductor industry. This state-of-the-art equipment boasts a multitude of impressive features to ensure accurate and efficient measurements of wafer samples.

Utilizing a displacement-type non-contact coaxial laser displacement sensor, this system guarantees precise measurements. The linear motor high precision gantry movement mechanism offers smooth and reliable scanning, while the coplanar air floating mobile bearing ensures the wafer sample moves with exceptional flatness and smoothness.

Our Wafer Measuring System is compatible with various types of wafers, including polished, unpolished, transparent, and non-transparent. It can accommodate wafer samples ranging from 1-8 inches, with the option to extend to 300mm (12-inch) products.

With a wide measurement range from 10um to 20mm, this system provides accurate thickness measurements. The maximum scanning speed of 1mu002Fs enables efficient data collection and analysis.

This system is not only capable of measuring wafer thickness, but also parameters such as TTV, LTV, TIR, Sori, Taper, Bow, and Warp, in accordance with industry standards.

Experience unparalleled precision and functionality with our advanced Wafer Measuring System. Improve your wafer manufacturing process and enhance product quality with this cutting-edge technology.