4365

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The PowerSeal, a high-quality encapsulation system, is designed to protect chip modules from mechanical stress and environmental factors. It uses cast resin, which is dispensed and cured using either UV light or heat, depending on the type of resin. With a maximum speed of 40,000 modules per hour, the PowerSeal ensures efficient encapsulation in the industry.

Another essential component in chip module production is the PowerTest - Chip Module Test System. It performs parametric and functional testing to inspect IC modules used in smart cards and RFID devices. This system plays a crucial role in maintaining production flow and ensuring quality assurance. The PowerTest is specifically designed for high-speed testing and encoding of chip modules on 35 mm tapes. It can also initialize and personalize IC modules, including loading operating systems.

For glue tape lamination of chip module tapes prior to the hot melt implanting process, the GTL700 - Glue Tape Lamination System offers high reliability and flexibility. This efficient system facilitates the lamination process necessary for chip module preparation.