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PCB depanelization plays a crucial role in the electronics manufacturing industry. In the production of large-scale electronic assemblies, such as printed circuit boards (PCBs) and surface mount (SMT) components, the process of depanelization is employed to enhance the overall efficiency. Typically, a PCB consists of multiple smaller individual boards, known as a panel or multi-block, which are later employed in the final product. To streamline the production process, the larger panel undergoes a depanelization step. Depending on the specific product, this step can occur immediately after the SMT process, following an in-circuit test (ICT), after soldering through-hole components, or even just prior to the final assembly of the PCBA in the enclosure. By breaking down the larger panel, manufacturers can optimize the throughput of their PCB and SMT production lines, ensuring the timely and efficient delivery of high-quality electronic assemblies.