0238

Grundinformation

• Verfügbar ab:
• Deutsche
• English

The Wafer Measuring System is specifically designed for the measurement of displacement-type non-contact coaxial laser displacement sensors. It utilizes a linear motor high precision gantry movement mechanism for accurate and precise measurements. This system is compatible with both polished and unpolished, transparent and non-transparent wafers, making it highly versatile for a wide range of applications.

The system is capable of handling 1-8 inch wafer samples, with the option to extend its compatibility to 300mm 12 inch products. The inclusion of a coplanar air floating mobile bearing ensures that the sample moves with exceptional flatness and smoothness, providing reliable and consistent results.

With a measurement range from 10um to 20mm, this system can accurately measure the thickness of wafers. Additionally, it offers a maximum scanning speed of 1mu002Fs, enabling efficient data acquisition and analysis.

Moreover, this system is equipped with various measurement parameters and standards, including thickness (TTV), local thickness variation (LTV), total indicator reading (TIR), sori, taper, bow, and warp. It is highly versatile and can be tailored to meet specific measurement requirements.

Overall, the Wafer Measuring System is a reliable and efficient solution for the precise measurement of wafer parameters in a variety of industries.